Assembly Materials

The Assembly Materials product line accounted for 58% of the Electronics division revenue from continuing operations in 2009.

The Assembly Materials product line is a leading global supplier of materials to assemblers of PCBs and to the semiconductor packaging industry.

In PCB assembly, the division's products are used to attach electronic components to a bare board and to form the necessary electrical and physical connections between those components and the board. Principal product lines include solder (which is available in bar, paste, powder and sphere form and in no-clean, water-soluble and lead-free options), fluxes, adhesives, cleaning chemistries and stencils.

The Assembly Materials product line supplies the semiconductor packaging industry with epoxy moulding compounds, underfill, encapsulant materials and solder balls which are used to connect the package to the PCB and to provide electrical and thermal insulation.

Assembly Materials is also a leading manufacturer of tin-lead and lead-free solders, pastes, fluxes and other materials to a number of markets which include plumbing, automotive and water treatment.

Further information about the Assembly Materials product line:
www.alphametals.com
www.cooksonsemi.com
www.frymetals.com
www.fernox.com